Mini Solderless Breadboard – 170 Tie Points White

QAR 7.00/ unit

Description

The Mini Solderless Breadboard is a compact prototyping platform designed for small electronic circuits and quick testing applications. It features 170 tie points with a standard 2.54 mm pitch, making it suitable for DIP IC breakout, sensor connections, and breadboard-based development projects. The snap-fit design allows multiple boards to connect together for expanded prototyping space, while the self-adhesive backing and M2 mounting holes provide secure installation options. Ideal for embedded systems, educational electronics, and rapid hardware prototyping. Features • 170 tie-point solderless prototyping area • Standard 2.54 mm pitch spacing • Compact design for small circuits • Snap-fit edges for board expansion • Peel-and-stick adhesive backing • Dual M2 mounting holes • Compatible with DIP package ICs • Supports reusable circuit prototyping • White ABS plastic housing • Nickel-plated spring contacts • Suitable for jumper wire connections • Lightweight portable construction • No soldering required • Reliable contact retention design • Ideal for educational electronics projects Tutorials • How To Use a Breadboard - Breadboard Basics