Full-Size Solderless Breadboard – 830 Tie Points

QAR 20.00/ unit

Description

The Full-Size Solderless Breadboard is designed for rapid prototyping, circuit testing, and electronics development without soldering. It features 830 tie points with dual split power rails and a standard 2.54 mm pitch layout compatible with DIP ICs, sensors, and development boards. The interlocking design allows multiple boards to be connected for larger projects, while the self-adhesive backing provides secure mounting during operation. Suitable for educational labs, embedded systems development, and electronic prototyping applications. Features • 830 total tie points for circuit prototyping • Standard 2.54 mm pin spacing • Dual split power rails design • Compatible with DIP IC packages • 10 terminal columns layout • 63 connection rows configuration • Self-adhesive backing for secure mounting • Interlocking side tabs for board expansion • Supports 20–29 AWG jumper wires • Solderless reusable construction • Nickel-plated contact clips • ABS plastic housing material • Suitable for Arduino and Raspberry Pi projects • Ideal for testing and educational applications • Compact full-size breadboard format 830 Tie Points Breadboard 3D Model Tutorials • How To Use a Breadboard - Breadboard Basics